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hong kong: tel: (+852) 23307800 fax: (+852) 24551101 or 24540883 e-mail: lcd@casilsemi.com china: tel: (+86-752) 2603531 or 2609617 fax: (+86-752) 2602033 or 2634396 e-mail: lcm@casilsemi.com customer approved: prepared by checked by approved by gao chang wen xie feng chang chong hui specification for lcd module CCM2441CSL-C free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 1 records of revision date rev. description note page 2008.7.30 1.0 new specation free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 2 contents 1 features 2 absolute maximum rating 3 mechanical parameters 4 led backlight characteristics 5 system block diagram 6 pin descriptions 7 characteristics of lcd module 8 electrical characteristics 9 timing characteristics 10 command description 11 character font table 12 reliability 13 specification of quality assurance 14 inspection criteria 15 package specification 16 precaution in use of lcd panels & lcm 17 assembly diagram free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 3 CCM2441CSL-C lcd module 1. features display type: stn display mode: yellow-green display format: 24 characters x 4 lines input data: 4-bits interface available polarize type: transflective, positive driving mode: 1/16duty, 1/5bias operating voltage: 4.5v viewing direction: 6 o?clock accord with rohs 2. absolute maximum rating item symbol min. max. unit power supply for logic vdd -0.3 +7.0 v power supply for lcd drive vlcd vdd-13.5 vdd+0.3 v input voltage vi -0.3 vdd+0.3 v operating temperature topr 0 +50 storage temperature tsgt -20 +70 3. mechanical parameters item description unit lcm outline dimension 93.0 x 60.0 x12.25 (max) mm viewing area 80.5 x 39.0 mm weight about 40.0 g 4.led backlight characteristics free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 4 5. system block diagram d ot m atrix l c d c ontroller (st7066u) d ot m atrix l c d c ontroller (st7066u) green-yellow backlight st7063c st7063c 6. pin descriptions no. symbol level function 1 vss -- ground 2 vdd -- power supply for logic 3 vee -- power supply for lcd 4 rs h/l register h: data register select l:instruction register 5 r/w h/l h--read l?write 6 e1 h, h-l start enable signal to read or write the data 7 e2 h, h-l start enable signal to read or write the data 8 nc -- 9 nc -- 10 nc -- 11 db4 h/l 12 db5 h/l 13 db6 h/l 14 db7 h/l data bus for 4 bit transfer 15 a h led+ 16 k l led- free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 5 7. characteristics of lcd module 1. driving conditions voltage ? duty ?? bias ?? 4.50v 1/16 1/5 2. maximum rating ? item ? standard value ?? unit operating temperature ? 0 +50 storage temperature ? - 20 +70 humid condition ? 70 dry condition 70 60 less than 90%r.h 60 ?? 90%r.h 40 less than 95%r.h 40 ?? 95%r.h 3. electro-optical characteristics standard value ?? no item? symbol temperature ? ( ) min type max unit remark ? vth 2 4.15 5.15 1 threshold voltage ?? vth 25 vth 1 4.13 5.13 v note.1 rise time ? t 25 100 150 2 response time ?? decay time ?? t f 25 255 305 ms note.2 3 frame frequency ? ff 64 hz note.3 = 0 1 20 = 90 2 10 =180 3 20 4 viewing angle ? =270 4 30 deg note.5 5 current consumption ? i 25 5 ua note.4 6 contrast ratio ?? cr 25 4 6 note.6 free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 6 other/ [ note 1] ? 1 threshold voltage (vth) and von , voff (fig. 1)/ ???? equipment & conditions/ equipment/ : eo100 (bfi) environment conditions/ 253 [note 2] ?2 definition and measurement co ndition of response tim ???? definition : rise time(tr) ? : the time required for a lcd to get 90% contrast from 10% lev el lcd????10%90%?? decay time(tf): ?? : the time in which contrast falls from 90% level to 10% level lcd????90%?10%?? conditions : a) temperature ? : 25 b)frame frequency ? : 64hz c)viewing angle ? : =10o,=270o d)applied voltage ? : v ?? ?? ? ? 1 free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 7 contrast ratio [note 3] ? 3 frame frequency / ? : 64 hz equipment : lcd tester lcd? : rpg 3200 unltimeter : fluke 87 [note 4] ? 4 definition and measurement condi tion of current consumption ?? definition/: current consumption/: the total maximum current that the l cd draws lcd ???? equipment: lcd tester: rpg 3200 [note 5] definition of viewing angle ( ) and viewing direction ( ) ????? ?? ?? ?? ? 2 ? ? ?? ?? free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 8 (1) z is the normal line perpendicular to the lcd surf ace. /z?lcd (2) shows the viewing angle for lcd, starting from t he normal line. /z?? (3) shows the viewing direction for lcd. /lcd?? viewing direction is at 12:00 oclock if =90 =90 ?12 viewing direction is at 6:00 oclock if =270 =270?6 viewing direction is at 3:00 oclock if =0 =0 ?3 viewing direction is at 9:00 oclock if =180 =180?9 [note 6] ? 6 definition and measurement co ndition of contrast ratio / ????? definition: contrast ratio/??(cr)= brightness under non-selected wave form/bright ness under selected wave form ??/?? 8.electrical characteristics (vss=0v, vdd=4.5v:t opr =25 ) item symbol condition min. typ. max. unit operating voltage vdd ta=25 4 4.5 5.5 v operating voltage for lcd v0 ta=25 4 4.5 5.5 v operating current idd ta=25 -- 70 -- ua 9. timing characteristics w rite m ode t iming d iagram fig.3 ? 3 free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 9 r ead m ode t iming d iagram ac characteristics (vdd=5.0v 5%,vss=0v ,ta=25 ) (write mode) characteristic symbol min. typ. max. unit e cycle time tc 500 -- -- ns e rise/fall time tr,tf -- -- 25 ns e pulse width (high, low) tpw 220 -- -- ns r/w and rs set-up time tas 40 -- -- ns r/w and rs hold time tah 10 -- -- ns data set-up time tdsw 60 -- -- ns data hold time th 10 -- -- ns (read mode) characteristic symbol min. typ. max. unit e cycle time tc 500 -- -- ns e rise/fall time tr,tf -- -- 25 ns e pulse width (high, low) tpw 220 -- -- ns r/w and rs set-up time tas 40 -- -- ns r/w and rs hold time tah 10 -- -- ns data set-up time tddr -- -- 120 ns data hold time th 20 -- -- ns free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 10 10. command description command rs r/w db7 db6 db5 db4 db3 db2 db1 db0 remark display clear l l l l l l l l l h write ?20h? to ddram.and set ddram address to ?00h? from ac. return home l l l l l l l l h x cursor move to first digit entry mode set l l l l l l l h i/d sh i/d: set cursor move direction h-increase l-decrease sh: specifies shift of display h-display is shifted l-display is not shifted display on/off control l l l l l l h d c b d: display (h-on, l-off) c: cursor (h-on, l-off) b: blinking (h-on, l-off) shift l l l l l h s/c r/l x x sc:(h-display shift, l-cursor move) r/l:(h-right shift, l-left shift) set function l l l l h dl n f x x dl:(h-8 bits interface, l-4 bits interface) n:(h-2 line display, l-1 line display) f:(h-5 x 10 dots, l-5 x 7 dots) set cgram address l l l h cg ram address (corresponds to address) cgram data is sent and received after this setting set ddram address l l h dd ram address ddram data is sent and received after this setting read busy flag & address l h bf address counter used for both dd cgram address bf:(h-busy, l-ready) --reads bf indication internal operating is being performed --reads address counter contents write data to ram h l write data write data into ddram or cgram read data from ram h h read data read data from ddram or cgram ?x?: don?t care free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 11 11.character font table free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 12 12. reliability no test item description test condition remark 1 high temperature storage applying the high storage temperature under normal humidity for a long time check normal performance. 60 ? c 240h 2 low temperature storage applying the low storage temperature under normal humidity for a long time check normal performance. -10 ? c 240h 3 high temperature operation apply the electric stress (voltage & current) under high temperature for a long time. 50 ? c 240h #1 4 low temperature operation apply the electric stress under low temperature for a long time 0 ? c 240h #1 #2 5 high temperature/hi gh humidity storage apply high temperature and high humidity storage for a long time 95%rh 50 ? c 240h #2 6 environmental test temperature cycle apply the low and high temperature cycle 30 min 30 min 30 min 30 min 25 ? c<->55 ? c(1h)<->25 ? c(1h)<->-10 ? c (1h)<->25 ? c(1h) ----------------------------------------------------------------- 1 cycle check normal performance -10 ? c/55 ? c 10 cycle 7 vibration test (package state) applying vibration to the product check normal performance freq.: 10-55hz max. acceleration: 5g x.y.x. each direction for 10 mines. 8 mechanical test shock test (package state) applying shock to the product check normal performance drop them through 70cm height to strike horizontal plane remark: #1: normal operations condition a. power supply for lcd driver voltage b. power supply voltage for lcd system: getting optimum contrast at 25 ? c #2: pay attention to keep dewdrops from the module during this test. free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 13 13. specification of quality assurance 1.acceptable quality level ? ? each lot should be satisfied the quality level defined as follows. -inspection method;mil-std-105e level normal one time sampling. -aql partition aql definition major 0.65 functional defective as product minor 1.0 satisfy all functions as product but not satisfy cosmetic standard 2.definition of ?lot? one lot means the delivery quantity for customer at one time. 3.conditions of cosmetic & functional inspection 3.1 environmental condition the inspection should be performed at the 1m of height from the lcd module under 2 pcs of 40w white fluorescent lamps (normal temperature 20 25 ? c and normal humidity 8515%rh). 3.2 inspection method the visual check should be performed verti cally at more 30cm?s distance from the lcd panel. 3.3 driving voltage operating voltage according to specification. 3.4 test pattern pattern will automatically displayed according to the software. free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 14 14. inspection criteria function failure defect define/description criteria 1 open circuit (major) reject 2 short circuit (major) reject 3 dim (major) according to sample reject 4 ghost (major) according to sample reject 5 high power consumption (minor) no exceed spec. ? according to engineering diagram acceptable number ?Q 0.1 mm ( ? ) disregard(no gathering) 0.10mm ?Q 0.2 mm 3 ( R 5 mm) (the distance between two points R 5mm) 0.2mm ?Q 0.25 mm 2 ? 0.25mm 0 ? 1/3 ?? >1/3 width of the character 0 0.10 mm ?Q 0.25mm 3 6 ?? pinhole, white spots , ? , ?? pin hole lack = (l+w)/ ( ? lcd ?? Q 3 , R 5mm). total amount on single lcd sheet Q 3,the distance between two points R 5mm acceptable number ? 0.25mm 0 ? 1/3 ?? >1/3 width of the character 0 7. ? : bar = (l+w)/2 ? ,1 1 , ? 3 acceptable case: per character, not more than 1; per cell, not more than 3. free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 15 defect define/description criteria 8. M assembly not match = (l+w)/2 1. b a 0.25mm (reject) 2. a/b Q 3/4 (reject) 3. ? deformed word, examined and accepted according to the limited sample dimension acceptable number ?0.1mm disregard 0.1mm?0.2mm (distance between two points10mm) 3 0.2mm?0.25mm (distance between two points20mm) 2 ?0.25mm 0 9. \ ? dot matrix pin hole lack ?1/3width of the character 0 10. ?? convex 1.a0.25mm 2.b0.05mm reject reject 11. assembly not match 1. a: distortion square? 0.15% 2. b: distortion square? 0.15% accept accept 12 ?? ( ? ) black spots ??????? black spots defect in working ?????????? according to item spots line glass disrepair standard free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 16 appearance inspection defect define/description criteria 1. ?? ( ? ) 1.leakage (major) lc over-flowing reject 2. ? ( ? ) 2. cracks (minor) ito glass crack ??? any crack reject 3. ?? ( ? ) 3 end sealant over height, over width (minor) ????? according to engineering diagram 4 ? ( ? ) permeating resin (minor) ??I? ?? d 1.5mm, ? baffle: not overstep baffle no baffle: d 1.5mm , reject 5 ?? seal line larger (minor) ??????? 1/3 ? ?????? ; a: greater than 4/3 width of average reject b: less than 1/2 width of average reject c: seal line enter into a area rejcet 6. ? rainbow (minor) different color in one panel ??????? ???????? according to the sample 7 ito ? pi coat defect (minor) design shows without voltage input ? according to the sample 8. ? cutting defect (minor)) 1. ????? d 0.3 mm 2. ??? a: large than mould b: the width of ?d? 0.3mm reject c according to engineering diagram defect define/description criteria 9 dirty spot of ito glass (minor) ?????? 03 / ? a: outside seal expose, disregard b: inside seal expose, according to spots line glass disrepair standard free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 17 10. ?? back print (minor) ?????? the position and appearance of the back printing defect a ????????? b ??? 1/4 ?? a broken line pinhole spot defect according to item 6.4.2,6.4.3 b width of print edge defect over 1/4 spec reject the size of pin defect ??? according to engineering diagram ? pin pin tilt 5 ( 5 reject ) ( ) ?? ( ? ) 0 number of pin defect reject ? pin ???????? pin glue permeates through polarize and glass or polari ze is polluted by pin glue reject ? pin ????? ( ) ? the height of pin glue over the front polarizes. reject ???? there is no glue between two pins reject uv ?? 2 ????? 2 uv glue: number of the pin which underpants has no glue 2 reject ???B? normal glue: number of the pin which underpants has no glue 1 reject standard accept d-e <1/6d disregard 1/6d ? d-e 1/3d 2 11. ? pin pin defect (min) ? ? pin ??? pitch of pins d ? d spec e ?? e actual d-e >1/3d 0 12.pcb warped the excess warped pcb which may affect module assembly reject 13.damaged pcb the circuit on pcb was scratched or broke reject 14. green paint was taken off on the pcb(the green oil on pcb is un- uniformity or scratched) reject 15.dirty pcb minor 16.smt is not in the right position, and the components is too high reject 17.the soldering on the pcb is bad (including back light and pins) reject 18.the label is bad reject 19.the protective film is bad minor spots line glass disrepair standard free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 18 defect define/description criteria ? normal (mm) a b 0.10 disregard disregard 0.10< 0.15 3 4 0.15< 0.2 2 3 1. ?? ( ? ) spots(minor) b a =(a+b)/2 0.2< 0.25 1 2 2. ( ? ) x ?? y ?? z ? k1 ?? t ? poor cutting (min) x: length y: width z: depth k1: length of pin ito t: depth of glass x 2.0mm y k1 /4 z 1/2t acc no. 2 cluster not acceptable not allow 2 defects within 10 mm ???? : x ?? , ? products with pins disregard x 2.0mm y k1 /4 z 1/2t acc no. 2 ???? : x ?? , ? products with pins disregard x 2.0mm y ?? 1.0mm y: not reach the seal line and 1.0mm z 1/2t acc no. 2 3. ( ? ) x ?? y ?? z ? k1 ?? t ? ?? x 2.0mm y ?? 1.0mm y: not reach the seal line and 1.0mm z 1/2t free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 19 defect define/description criteria x y z large 3 k1/3 1/2t ? conductive layer broken reject 4. ( ? ) ?? corner damage (minor) acc no. 2 x: 2.0mm y: ? 1/3 z: 1/2t x: 2.0mm and not reach the common point y: not over the 1/3 width of common point d 1.d 0.2mm d k1/4 2.according to engineering diagram ?? according to engineering diagram 5. ? ( ? ) poor cutting (minor) 1.d 0.20mm d k1/4 2. ??? according to engineering diagram l(mm) w(mm) a area b area acc w 0.02 ignored ignored l 2.0 w 0.04 2 3 l 2.0 0.05 w 1 2 6.. ?? ( ? ) linear scratch (minor) 1. not allow 2 defects within 10 mm distance 2. cluster not acceptable l>2.0 w<0.05 0 0 ?? polarizer damage ????? a: polarize strike b:perforate according to item 1 and 6 ?? polarizer attachment skew ??????????? a: protuberance at the edge of glass reject b: not cover the seal line reject ? 0.2 L 0.2 L ? 0.3 L 1 0.3 L 0 7 ?? ( ? ) polarize defect (minor) ? polarizer bubble 0.2mm ?? cm2 2 number of spots ( 0.3mm) per cm2 2 free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 20 15. package specification 5 ??? 1 ?(csl-5)?? 4 ???(3x2)?? ???? 3 ??? ?? ???? polyfoam tray (csl-5) empty box ok box cardboard three polyfoam tray and the cardboard put in front side moistureproof bag ?? (packing specification) three pcs of polyfoam trays in a moistureproof bag two moistureproof bag in a box ?(lcm)?? productions in polyfoam tray (???) 2 ??????? 16. precaution in use of lcd panels & lcm 1.1 storage when long-term storage is required, the following precautions are necessary. (1) store them in a sealed polyethylene bag (antistatic type), seal the opening, and store it where it is not subjected to direct sunshine, or to the light of a fl uorescent lamp. if properly sealed, there is no need for desiccant. (2) store them in the temperature range of 0 ? c -35 ? c and low humidity is recommended. 1.2 precaution for handing lcd modules lcd modules are assembled and adjusted with a high degree of precision, do not applying excessive shocks to it or making any alterations or modifications to it. the following precautions should be taken when free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 21 handing. (1) do not drop, bend or bend or twist the module. (2) do not alter or making any modification on the shape of the plastic frame. (3) do not change the shape, the pattern wiring or add any extra hole on the printed circuit board. (4) do not change the positions of components on the pcb. 1.3 precaution for soldering to lcd module (1) soldering should apply to i/o terminals only. (2) soldering temperature is 280 ? c+ 10 ? c (3) soldering time 3 to 4 seconds (4) eutectic solder (rosin flux filled) should use. (5) if soldering flux is used, be sure to remove any remaining flux after finishing the soldering operation and lcd surface should be covered during soldering to prevent any damage due to flux spatters. (6) when removing the lead wires from the i/o terminals, use proper de-soldering methods e.g. suction type- disordering irons. do not repeat wiring by soldering mo re than three times as the pads and plated through holes may be damaged. 1.4 electro-static discharge control careful attention should be paid to control the electrostatic discharge of the modules, since lcd modules contain no. of coms lsi. (1) make sure you are grounded properly when removing lcd module from its antistatic bag. be sure that the module and your body have the same electric potential. (2) only properly grounded soldering iron should be used. (3) modules should store in antistatic bag or other containers resistant to static after remove from its original package. (4) when using the electric screwdriver is used, make sure the screwdriver had been ground potentiality to minimize the transmission of em waves produced by commentator sparks. (5) in order to reduce the generation of static electricity, a relative humidity of 50-60% is recommended. (6) electrostatic discharge value:4 kv. 1.5precaution for operation (1) adjust liquid crystal driving voltage (vo) to varies viewing angle and obtain the best contrast. (2) vo should be kept in proper range stated in the specification. excess voltage will shorten the lcd life. (3) response time is greatly delayed at temperatures below the operating temperature range. it will recover when it returns to the specified temperature range. (4) if the display area is pushed hard during operation, the display will become abnormal. however, it will return off and then back on. (5) condensation on terminals can cause an electrochemical reaction disrupting the terminal circuit. therefore it must be used under the relative condition of 50% rh. free datasheet http:///
casil semiconductor ltd casil optoelectronic pr oduct development ltd. 22 17. assembly diagram gcw 2007.12.15 ccm2441csl?c lcm ?? free datasheet http:///

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